Chassis

The chassis available from Wakefield Thermal can help with thermal management for many devices. It offers both optimal structural and thermal performance to ensure that the electronic device is not overheating and damaging the overall performance of the device. It works well with the rest of the components to limit the thermal consumption of the device. For more information on the quality and performance of the chassis, please contact us.

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Bolted/Bonded Construction

Combination Construction

Brazed Construction

As we look to complete the infrastructure associated with Mil/Embedded computing we come to the most challenging component (top of the pyramid) which is the chassis. It is the responsibility of the chassis to protect the heat frames both structurally and thermally by transferring their heat to the external ambient. The chassis can range in structural requirements from very basic to very complex where they are designed to meet:

MIL-STD-810 – Shock/vibration, Environmental
MIL-STD-901D -- Shock/vibration
MIL-STD-461 – EMC
ARINC 404 and 600 – standard ATR sizes

There are multiple methods of construction associated with the chassis depending on the mechanical and structural requirements. Any of the construction method could be used to design and build a chassis to support:

Vita 48

48.5 – Air Flow-Thru module
48.7 – Air Flow-By module
48.8 – Liquid Flow-Thru module

VME
cPCI
Vita 65 – OpenVPX
ATCA

but some methods may be better suited for specific design reasons.

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Chassis

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