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Thermal Solutions from Smart to Finish
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Part #:


 

Series Ellipitical Fin Heat Sinks for Chipsets > 901-22992test


Wakefield-Vette’s 900 Series Heat Sinks for Chipset can match up to devices from Intel, Broadcom, Xilinx, TI, Motorola, ATI, AMD, Nvidia, Vishay, Powerex, Infineon, Microsemi, and many more.

These heat sinks are designed for air flow applications in the Telecom, Data Center, Networking, Cloud Computing, and many more Industries.


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