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Pin Fin Heat Sinks for Chipsets (900 Series)

 

Wakefield-Vette’s 900 Series Pin Heat Sinks for Chipsets can match up to devices from Intel, Broadcom, Xilinx, TI, Motorola and many more.

These heat sinks are designed for air flow applications in the Telecom, Data Center, Networking, and Cloud Computing Industries.

Material: AL 6063

Finish: Black Anodize

ROHS Compliant



900 PIN SERIES GROUP DATA SHEET


901-910 PIN SERIES DATA SHEETS (WITH THERMAL GRAPHS):


901 Pin Series

902 Pin Series

903 Pin Series

904 Pin Series

905 Pin Series

906 Pin Series

907 Pin Series

908 Pin Series

910 Pin Series

Click Here for Elliptical Fin Heat Sinks

Attachment Video



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