FEATURES AND BENIFITS 

● Excellent Thermal Conductivity

● Natural Tackiness – no need for adhesive

● Excellent Compression Characteristics

● Good Wet-Out and Superb Flexibility

● Excellent Converting Properties

● RoHS and HF Compliant

Wakefield-Vette's ulTIMiFlux™ line of thermal interface materials offer high performance, low cost, configurability and custom sizes for your thermal system needs.  Thermal Interface Materials (TIM) are a secondary material installed between the heat sink and the device which are designed to improve the thermal transfer to the heat sink. Regardless of how flat or smooth the device and heat sink are, there will always be small air voids between the two surfaces. Since air is a not a great conductor of heat, a TIM replaces the air and fills the voids. There are many types of TIMs and each has its best case usages.  Wakefield-Vettes’s line of thermal gap filling pads are intended to fill a large void between a device and the heat sink. A gap pad is a compressible material most commonly used when there are multiple devices to be contacted to the heat sink, but all the different device heights make it difficult to use a thin material. These materials come in a variety of thicknesses, conductivities, and durometers to meet a wide range of needs.

Custom Sizes Available Upon Request

 Part Number Configuration:  

 PL-Thickness- W/ m K- Foot Print – Hypersoft Option

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