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ulTIMiFlux Dielectric Phase Change Thermal Material



60ºC/140ºF PHASE-CHANGE TEMPERATURE


FEATURES AND BENIFITS 

● Low Thermal Impedance

● Excellent Replacement for Thermal Greases

● Thixotropic / Prevents Compound Run-Out

● Excellent Mechanical & Dielectric Properties

● Cost Effective  “Drop in Place” Solution

● RoHS and Halogen Free Compliant


Wakefield-Vette's ulTIMiFlux line of thermal interface materials offer high performance, low cost, configurability and custom sizes for your thermal system needs.  Thermal Interface Materials (TIM) are a secondary material installed between the heat sink and the device which are designed to improve the thermal transfer to the heat sink. Regardless of how flat or smooth the device and heat sink are, there will always be small air voids between the two surfaces. Since air is a not a great conductor of heat, a TIM replaces the air and fills the voids. There are many types of TIMs and each has its best case usages.  Wakefield-Vetts’s line of dielectric phase change thermal materials are intended to fill voids between a device and the heat sink and utilizes a polyimide film to act as a thermally conductive carrier in order to deliver a uniform thickness coating of phase-change thermal compound on both sides.  

Through the development of this unique formulation, Wakefield-Vette’s phase change solution offers efficient thermal transfer by phase-changing during normal device operating temperatures while maintaining a uniform bond line thus driving out the air and adjusting for any surface imperfections or flatness conditions that may exist across the interface.This construction is useful in a wide range of electronic cooling applications from transistors, diodes or any type of heat generating non-isolated power device.

A primary advantage of utilizing a phase-change system is the ability to drive out air from within the interface during initial device cycling causing phase change and surface wetting of the thermal compound coating.  The phase-change compound is available in specific die cut patterns for common TO packages and can be placed instantly and immediately ready for component mounting.   Due to it’s thixotropic formulation design, compound is held within the interface with no worries of run-out into unwanted areas during normal device/component operation.  

Wakefield-Vette's phase-change product is a solvent free high performance dielectric thermal interface material that is designed to provide efficient thermal transfer by providing precision phase-change and a uniform bond line thickness across a device/component mounting interface.  The pads are designed as a pre-formed thermally conductive “drop in place” solution that offers excellent thermal transfer characteristics. From an installation perspective, thermal greases are difficult to dispense as well as provide inadequate coverage and a uniform thickness across the interface most often leaving trapped air leading to poor thermal transfer.   Not to mention the thermal grease clean up required in unwanted areas afterwards.   


Click Here for Full Data Sheet


WV Part Number

 Description

Size

For use with

CD-02-05-220

Phase Change TO-220 Pad with mounting hole

0.70” x 0.50”, single mounting hole

T0-220, with mounting holes

CD-02-05-247

Phase Change TO-247 Pad with mounting hole

0.95” x 0.75”, single mounting hole

TO-247, with mounting holes

CD-02-05-264

Phase Change TO-264 Pad with mounting hole

1.05” x 0.85”, single mounting hole

TO-264, with mounting holes

CD-02-05-025

Phase Change 1” x 1” Square Pad

1” x 1”, no holes

General Use

CD-02-05-127

Phase Change 5” x 5” Square Pad

5” x 5”, no holes

General Use

CD-02-05-190

Phase Change 7.75” x 10.00” Rectangular Pad

7.75” x 10.00”, no holes

General Use

CD-02-05-LED-1

Phase Change LED 1 Inch OD Circle Pad

1.00" Diameter Circle, No ID

LED

CD-02-05-LED-2

Phase Change LED 2 Inch OD Circle Pad

2.00" Diameter Circle, No ID

LED

CD-02-05-220-N

Phase Change TO-220 Pad,  NO HOLE

0.70" x 0.50" NO HOLE

TO-220 with no mounting hole

CD-02-05-247-N

Phase Change TO-247 Pad,  NO HOLE

0.95" x 0.75" NO HOLE

TO-247 with no mounting hole

CD-02-05-220-2

Phase Change Dual Mount TO-220 Pad, 2 holes

1.00" x 0.50" 2 holes

Dual Mount TO-220

CD-02-05-220-3

Phase Change Triple Mount TO-220 Pad, 3 holes

1.50" x 0.50", 3 holes

Triple Mount TO-220

CD-02-05-247-2

Phase Change Dual Mount TO-247 Pad, 2 holes

1.50" x 0.95", 2 holes

Dual Mount TO-247

CD-02-05-247-3

Phase Change Triple Mount TO-247 Pad, 3 holes

2.25" x 0.95", 3 holes

Triple Mount TO-247

CD-02-05-218

Phase Change TO-218 Pad with hole

0.80" x 0.60" with hole

TO-218 with mounting hole

CD-02-05-126

Phase Change TO-126 Pad with hole

0.50" x 0.35" with hole

TO-126 with mounting hole

CD-02-05-66

Phase Change TO-66 Pad, 2 pin

1.25" x 0.70", 2 pin

TO-66 (std 2 pin)

CD-02-05-3-2

Phase Change TO-3 Pad, 2 pin

1.55" x 1.05", 2 pin

TO-3 (2 pin configuration)

CD-02-05-3-4

Phase Change TO-3 Pad, 4 pin

1.55" x 1.05", 4 Pin

TO-3 (4 pin configuration)

CD-02-05-3-8

Phase Change TO-3 Pad, 8 pin

1.55" x 1.05", 8 Pin

TO-3 (8 pin configuration)

CD-02-05-DO4

Phase Change DO-4 Pad, 0.625" OD / 0.203" ID

0.625" OD / 0.203" ID

DO-4

CD-02-05-DO4-5

Phase Change DO4/5 Pad 0.800" OD / 0.260" ID

0.800" OD / 0.260" ID

DO-4 / DO-5

CD-02-05-DO5

Phase Change DO-5 Pad 1.00" OD / 0.250" ID

1.00" OD / 0.250" ID

DO-5

CD-02-05-REC-125

Phase Change Rectifier Pad 1.25" x 1.25" with hole

1.25" x 1.25" with hole

Rectifier

CD-02-05-REC-125-N

Phase Change Rectifier Pad 1.25" X 1.25", NO HOLE

1.25" X 1.25", NO HOLE

Rectifier

CD-02-05-REC-112

Phase Change Rectifier Pad 1.12" x 1.12" with hole

1.12" x 1.12" with hole

Rectifier

CD-02-05-BRI-225

Phase Change Bridge Rectifier Pad 2.25" x 1.75", 2 End Slots

2.25" x 1.75", 2 End Slots

Bridge Rectifier

CD-02-05-C-18

Phase Change Chipset Pad 0.689" x 0.689", No Hole

0.689" x 0.689", No Hole

17.5mm x 17.5mm, chipset

CD-02-05-C-20

Phase Change Chipset Pad 0.768" x 0.768", No Hole

0.768" x 0.768", No Hole

19.5mm x 19.5mm, chipset

CD-02-05-C-22

Phase Change Chipset Pad 0.846" x 0.846", No Hole

0.846" x 0.846", No Hole

21.5mm x 21.5mm, chipset

CD-02-05-C-26

Phase Change Chipset Pad 1.003" x 1.003", No Hole

1.003" x 1.003", No Hole

25.5mm x 25.5mm, chipset

CD-02-05-C-34

Phase Change Chipset Pad 1.319" x 1.319", No Hole

1.319" x 1.319", No Hole

33.5mm x 33.5mm, chipset

CD-02-05-C-39

Phase Change Chipset Pad 1.516" x 1.516", No Hole

1.516" x 1.516", No Hole

38.5mm X 38.5mm, chipset

CD-02-05-C-46

Phase Change Chipset Pad 1.811" x 1.811", No Hole

1.811" x 1.811", No Hole

46mm X 46mm, chipset

CD-02-05-C-49

Phase Change Chipset Pad 1.909" x 1.909", No Hole

1.909" x 1.909", No Hole

48.5mm X 48.5mm, chipset

CD-02-05-C-54

Phase Change Chipset Pad 2.106" x 2.106", No Hole

2.106" x 2.106", No Hole

53.5mm x 53.5mm, chipset



Property/Characteristic

Value

Base Phase Change Formulation

Proprietary

Phase Change Temperature

60oC / 140oF

Viscosity @ Phase Change

Thixotropic

Overall Thickness

0.003” +/- 10%

Color

Orange

Separator Liner / Color

White

Total Mass Loss, % TML

0.138

Collectible Volatile, Condensable Matter, % CVC

0.130

Water Vapor Gain, % WVR

0.021

Storage Condition and Temperature

Cool Dry Location at or below 35oC / 95oF

Shelf Life

Indefinite if stored per conditions above

Transit Methods / Conditions

Due to temperature sensitive design, it is recommended to ship air freight during warmer months to prevent phase-change of thermal compound during long ground transit (May-September)

Thermal Impedence

0.107 oC-in2 / Watt (@100 PSI)

UL Flammability Rating

UL94V-0




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